• Beautiful product appearance, reasonable structure and multi-module in parallel connection
• All modules are same. When one module need to be replaced, just dial the address code of the new module same as the replaced one.
• All modules have hot-plug function, that is one module can be replaced without turning off full power and will not influence its running.
• All modules are controlled by advanced RS485 network control system. The control precision is very high. The transmission have no attenuation due to digital signal. The remote control distance can reach maximum 1.2KM.
• The automatic current equalization technology is used among all modules. The external controller is set with a certain current. The system will averagely assign the current to all uniform module. The current equalization precision is within 1% among different modules.
• For high-power type power supply, it can be designed with N+X redundant spare system. Once one module fails, the system will automatically bypass the failed unit and share the current to other nice running modules, so keep the same output voltage and current. The failed module is taken out for repair, this design largely increase the using stability of the power supply.
• Regulated voltage and current mode can be optional.
• Soft start, over-voltage, over-current, phase failure and over-heat protection.
• RS485 full digital network control.
• The three proofing glue is used to prevent against salt, fog and acidification in the internal PCB boards, increasing the environmental anti-corrosion capability of electronic components.

PCB electroplate, surface treatment of precious metal, battery industry and surface treatment of hardware parts.

Types of plating:

1. Copper plating: priming, enhance the ability to adhere to the plating layer, and the ability to resist corrosion. (Copper is easy to oxidation, oxidation, copper green no longer conductive, so copper-plated products must do copper protection)
2. Nickel plating: priming or appearance, to enhance the corrosion resistance and wear resistance, (where the chemical nickel for the modern process of wear resistance than chrome plating). (Note that many electronic products, such as DIN head, N head, no longer use nickel priming, mainly because nickel is magnetic, will affect the electrical properties inside the passive intermodulation)
3. Gold plating: improve the conductive contact impedance, enhance signal transmission. （Gold is the most stable, but also the most expensive.)
4. Palladium-nickel plating: improve the conductive contact impedance, enhance signal transmission, wear resistance than gold.
5. Tin-lead plating: improve soldering ability, soon to be replaced by other substitutes (because of the lead content is now mostly changed to bright tin and mist tin plating).
6. Silver plating: improve the conductive contact impedance, improve signal transmission. (Silver performance is the best, easy to oxidation, oxidation also conductive)