Input parameters: Three phase AC380V±10%, 50HZ
Output parameters: DC +6V/-18V +800A/-2400A
Output mode: High speed positive and negative pulse
Cooling method: Air cooling
Power supply type: IGBT-based
Application Industry: PCB Naked layer copper plating
The AC input voltage is transformed by a transformer to obtain low-voltage AC, rectified into DC by a rectifier bridge, and finally chopped by a MOS tube to obtain the required output pulse waveform. The control circuit samples the output current waveform and generates a pulse width modulation (PWM) signal to control the inverter circuit after closed-loop feedback to keep the output current waveform stable.
PCB plating may be defined as one or both of the following: Via plating – the process of filling a drilled hole with copper to provide a path for current from a surface of the board to an inner layer, between two inner layers or from one surface to the other. These plated through holes (PTHs) are better known as vias.
Electroless copper deposition is widely used in the printed circuit board industry for plating onto bare laminate to make non-conductive substrates conductive for further electroplating, and for plating through holes to connect circuits in different layers. The principle of electroless copper deposition is to use the chemical reaction between a reducing agent and a copper salt in a liquid solution so that the copper ion can be reduced to a copper atom. The reaction should be continuous so that sufficient copper can form a film and cover the substrate.
|Items||Parameter Items||Parameter details|
|Input||Rated voltage||Three phase AC380V±10% 50HZ|
|Rated Current||AC 18A|
|Output||Rated Voltage||DC +6V/-18V|
|Rated Current||DC +800A/-2400A|
|Protection||Self-protective function under the abnormal situations
such as over-voltage, over-current, over load，short circuit, overheating and so on
|Operation||Products can be continuously full-load running|
|Load Grade||Class Ⅱ|
|Insulation Grade||Class B|
|Size||H720mm×W750 mm×D800 mm|
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